| Company Name | Yamashita Materials Corp. |
|---|---|
| Location | Zama-City , Kanagawa, JAPAN |
| Established | June 15th, 1965 |
| Capital | 250 Million JPY |
| Net Sales (FY ended 3/31/2019) |
2,520 Million JP （year 2021） |
| Number of Employees | 137 |
Brief specification
Application record
Ultrafine Circuit High-Frequency FPC can be used for high-frequency applications above GHz band and bare chip mounting.
Circuit formation by semi-additive process (SAP) using liquid crystal polymer (LCP) with a low dielectric property as a core material enables the formation of 100 Ω differential transmission lines at a wiring pitch of 50 µm or less.
Also, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is applied on a mounting pad to support wire bonding mounting with bare chips.
The semi-additive process is characterized by high circuit formation accuracy of ±5µm, making it an ideal method for impedance control.
The followings is an example. Please contact us for availability of specifications.
| Number of layers | 2 |
|---|---|
| Interlayer connection Via | Through-Via（φ0.1mm～） |
| Base material | LCP（Liquid crystal polymer） |
| Covercoat | Low dielectric coverlay、Solder resist |
| Conductor thickness | 20μm（Reference） |
| Line/Space | L/S=20μm/20μm（Reference） |
| Surface treatment | Gold flash plating ENEPIG |
| Impedance matching | Differential 100Ω±10% |
Multi-layer flexible board adaptable for fitting card edge connecter with double-sided contant
