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Analog
![Sample Preparation](/global/en/media/no_image_tcm27-163222.png)
![Electron Microscopes (SEM/TEM/STEM)](/global/en/media/no_image_tcm27-163222.png)
![Field Instruments/Analyzers](/global/en/media/no_image_tcm27-163224.png)
![Scanning Probe Microscopes (SPM/AFM)](/global/en/media/no_image_tcm27-163222.png)
![Focused Ion Beam Systems (FIB/FIB-SEM)](/global/en/media/no_image_tcm27-163222.png)
PRODUCT
Focused Ion Beam Systems (FIB/FIB-SEM)
Introduction of Focused Ion Beam Systems (FIB/FIB-SEM)
![Processing Machine for MEMS Device](/global/en/media/no_image_tcm27-163222.png)
![Thin Film Equipment](/global/en/media/no_image_tcm27-163222.png)
![Power device Evaluation Equipment](/global/en/media/no_image_tcm27-163222.png)
![Compact ion beam etching machine](/global/en/media/ind_man_ion_001_main_png_tcm27-27713.png)
![Single wafer type ion beam etching machine](/global/en/media/ind_man_ion_002_main_png_tcm27-27720.png)
PRODUCT
Single wafer type ion beam etching machine
Product information of Single wafer type ion beam etching machine.
![Batch type ion beam etching machine](/global/en/media/ind_man_ion_003_main_png_tcm27-27739.png)
PRODUCT
Batch type ion beam etching machine
Product information of Batch type ion beam etching machine.
![Batch Type Wet Station](/global/en/media/batch_main_jpg_tcm27-25634.jpg)
PRODUCT
Batch Type Wet Station
Our system has batch type cleaning ,resist stripping and etching potions. All processes from chemical cleaning to dryer are fully automated.
![Spin Processor (MSP-1)](/global/en/media/msp-1_main_jpg_tcm27-25643.jpg)
PRODUCT
Spin Processor (MSP-1)
This spin processor is suitable for R&D and small production. All processes from chemical process to dryer are in one cup.
![Multi Spin Processor (MSP-2)](/global/en/media/msp-2_main_jpg_tcm27-25651.jpg)
PRODUCT
Multi Spin Processor (MSP-2)
Multi spin processor is suitable for mass production and Multi complex process.
![CD-SEM & Defect Inspection](/global/en/media/no_image_tcm27-163222.png)
![Conductor Etch System M-600/6000 Series](/global/en/media/semi-m6000_main_jpg_tcm27-26615.jpg)
PRODUCT
Conductor Etch System M-600/6000 Series
Conductor Etch System M-600/6000 Series is targeted for deep silicon trench etch of power devices used in mobile systems, home electrical appliances, automobiles, trains, etc. Low temperature etch technology and TM (Time Modulation) bias technology together with the ECR (Electron Cyclotron Resonance) high density plasma source provide for a clean process, superior trench profiles without sidewall residue, and excellent productivity.
![Production Support Program](/global/en/media/semi-support_main_jpg_tcm27-26614.jpg)
PRODUCT
Production Support Program
Hitachi High-Tech provides the following production support programs with the concept of "achievement of total solution services to enhance the value-added equipment and to reduce operation cost.
![Microwave ECR Plasma Etch Chamber](/global/en/media/image01_tcm27-222266.png)
PRODUCT
Microwave ECR Plasma Etch Chamber
Hitachi High-Tech's plasma chamber for conductor etch is based on an an ECR(Electron Cyclotron Resonance) plasma source, able to generate a stable high-density plasma at very low pressure (< 0.1 Pa). Microwave ECR plasma provides a wide process window in both R & D and mass production through accurate plasma parameter management, such as plasma distribution or plasma position control. The same plasma control technology is also applied to dry cleaning to maintain a more stable chamber condition.