Batch type ion beam etching machine
![Batch type ion beam etching machine](/global/en/media/ind_man_ion_003_main_png_tcm27-27739.png)
Features
- Bucket type ion source of maximum Φ 580mm.
- Both high uniformity and high throughput are possible.
- Control of etching rates is possible high and low.
- Wafer (substrate) self-revolving stage.
- Corresponding to irregular-shaped substrates such as rectangular substrates and mixed irregular substrates, it is also possible to combine substrate sizes.
Main Applications
- Fine processing for printer heads, etc.
Machine evaluation
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We will provide sample processing tailored to the customer's application for free for the first time.
Please make inquires our company regarding wafer size, number of wafer for processing, etc.
![-](/global/en/media/ind_man_ion_003_01_jpg_tcm27-27697.jpg)
![-](/global/en/media/ind_man_ion_003_02_jpg_tcm27-27698.jpg)
Specifications
Type | IM-580 |
---|---|
Ion source size | Φ580 |
Ion source voltage | 300~1000V |
Current density | ~1mA/cm2 |
Object substrate | φ4 " × 10 9 × 5 φinches 8 × 6 " |
Holder movement | Revolution/Inclination (*) |
Holder cooling | Water cooling / Gas cooling |
Wafer replacement | Manual |