Micro-sampling System
![Micro-sampling System](/id/en/media/fibmicro_main_tcm39-62264.jpeg)
This device is used for preparing the desired wafer part for analysis with STEM, TEM, etc. by extracting a micro sample with an ion beam in the vacuum chamber of an FIB system.
Features
FIB micro-sampling unit and FIB micro-sampling method
![-](/id/en/media/fibmicro_e_zu1_gif_tcm39-71318.gif)
![-](/id/en/media/fibmicro_e_zu2_gif_tcm39-71319.gif)
An example of FIB micro-piller sampling
A micro-pillar sample including an analysis point is directly cut out of semiconductor device. Micro-samples are cut out or trimmed in various shape by varying the incident FIB-direction.
![-](/id/en/media/fibmicro_e_zu3_gif_tcm39-71320.gif)
![-](/id/en/media/fibmicro_e_zu4_gif_tcm39-71321.gif)
System configuration example
FIB-STEM System
A new-developed semiconductor device evaluation system consists of FB2200 FIB system and HD-2700 200 kV STEM. The system performs from searching defective points to analyzing structure in sub-nano meter scale within several hours.
![-](/id/en/media/fibmicro_e_zu5_gif_tcm39-71322.gif)
Observation case
An example of DRAM observation
SEM image of a micro-pillar specimen on the needle stub
![-](/id/en/media/fibmicro_e_zu6_gif_tcm39-71323.gif)
Bright field STEM image of a micro-pillar specimen
![-](/id/en/media/fibmicro_e_zu7_gif_tcm39-71324.gif)