Compact ion beam etching machine
Features
- Etching rate control is possible high and low
- Rotating and tilting wafer holder.
- Plenty of chuck types can be selected.
- Compact footprint
- End point detection system (Apply Option With Load Lock).
Main Applications
- Electronic devices, MEMS manufacturing, microfabrication research, development, prototyping, small volume production applications, etc.
- Ion irradiation to a small solid object, etc.
Equipment evaluation
We will provide sample processing tailored to the customer's application for free for the first time.
Please make inquires our company regarding wafer size, number of wafer for processing, etc.
Specifications
| Type | IM-150 |
|---|---|
| Ion source size | Φ150 |
| Ion source voltage | 300～1000V |
| Current density | ～1mA/cm2 |
| Object substrate | 1 × Φ4" |
| Holder motion | Rotation and inclination |
| Holder cooling | Water cooling/ Gas cooling |
| Wafer replacement | Manual |
Load lock is also available.
