Multi batch type wet station

Configuration

Features

• All processes from chemical cleaning to dryer are fully automated.
• Carrier transfer and carrier loess transfer is selectable
• You can configure for your application.
• Layout is In-line type and through-the –wall type.
• Si wafer, glass substrate, compound wafer and so on is applied.
• Round wafer and square wafer is applied
• Dry method is selectable, spin ｄｒｙer ,IPA vapor dryer and hot blower.
• inorganic acid inorganic alkali organic acid organic alkali function water can be use
• You can choose many option ultrasonic cleaning rocking mechanism reversing mechanism

Example