Conductor Etch System 9000 Series
Next generation devices at 20nm and below require double-patterning, 3D (three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi High-Tech developed the Conductor Etch System 9000 Series to support these next-generation processes.
Features
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The new HHT 9000 platform utilizes Hitachi’s proprietary low-contaminant, high-speed transfer system for high productivity.
The linked common platform permits process flexibility and future expansion through its modular chamber design. - Platform and user interface standardization will facilitate a smooth transition to 450-mm wafer sizes.
- The 9000 platform incorporates HHT’s new microwave ECR(Electron Cyclotron Resonance) plasma etching chamber that is proven in high volume manufacturing usage.
Specification
| Applicable wafer diameter | 300mm |
|---|---|
| System configuration | 9 chambers (max.) |
* These photographs are partially different from actual systems.
