EMCP Etch Chamber
Hitachi High-Tech features EMCP(Electro Magnetically Coupled Plasma) as an unique solution with integrated cleaning technology for non-volatile material etch.
It offers highly productive etch of non-volatile materials used for next generation memories and thin film heads for HDD(Hard Disk Drive).
Overview
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Wafer Size
HDD:150mm, 200mm
Si:200mm, 300mm - EMCP Plasma source
- Dual Inductive Coils for plasma uniformity control
- In situ cleaning
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Non-volatile materials etch capability
Al2O3, Ni-alloys, Cr-alloys, Fe-alloys, Ta, Ir, Mn, Pt-Alloys, Au, PZT, SBT, and others.
Applications
- Next generation Memory (FeRAM, MRAM, ReRAM) Cells
- HDD Head
